Union Cabinet approves four new semiconductor plants in Odisha, Punjab, and Andhra Pradesh
The Union Cabinet has approved four new semiconductor projects under the India Semiconductor Mission (ISM), bringing the total to ten. Two plants will be in Bhubaneswar (Odisha), and one each in Punjab and Andhra Pradesh. These projects have a cumulative value of ₹4,594 crore and are supported by the ₹76,000-crore ISM. The firms involved include SiCSem (silicon carbide integrated facility), Continental Device India Private Limited (expanding existing facility), 3D Glass Solutions Inc. (advanced packaging), and Advanced System in Package (ASIP) Technologies (semiconductor unit). The initiative aims to boost India's capacity in critical semiconductor technologies, particularly silicon carbide.
Key Points
- The Union Cabinet has approved four new semiconductor manufacturing projects under the India Semiconductor Mission.
- These projects, located in Odisha, Punjab, and Andhra Pradesh, will enhance India's domestic semiconductor production capabilities.
- The mission provides significant financial support to semiconductor units, totaling ₹76,000 crore.
- The focus includes developing capacity in evolving fields like silicon carbide technology, crucial for strategic independence.
Exam Facts
- Four new semiconductor projects were approved, bringing the total under ISM to ten.
- The cumulative value of the four new projects is ₹4,594 crore.
- The India Semiconductor Mission (ISM) has an outlay of ₹76,000 crore.
- SiCSem Pvt Ltd will establish a silicon carbide integrated facility in Bhubaneswar, Odisha.
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